2014 台灣國際雷射應用展 - Laser Expo Taiwan ... 應用（台灣雷射應用發展協會）兩大台灣雷射龍頭，齊心協力舉辦2014年度『台灣國際雷射應用展 』及擴大研討會論壇規模，並邀請歐、美、亞等更多先進國家買主及相關公協會帶領廠商參與本屆雷射應用展，集結國內外產、官、學，針對雷射技術應用 ...
微新精密股份有限公司 半導體應用 陶瓷材料雷射鑽孔 Ceramic Laser Drilling 雷射加工目前運用於探針卡(Probe Card)業界，用於製作Probe Card Guiding Plate，利用紫外光雷射微細加工( UV Laser Micromachining )的特性，於陶瓷材料(含氮化矽、碳化矽、氮化鋁等)上 ...
OPTIMIZATION OF UV LASER SCRIBING PROCESS FOR LED SAPPHIRE WAFERS Paper# M701 Ashwini Tamhankar and OPTIMIZATION OF UV LASER SCRIBING PROCESS FOR LED SAPPHIRE WAFERS Paper# M701 Ashwini Tamhankar1 and Rajesh Patel1 1 Spectra-Physics Lasers, Newport Corporation, 3635 Peterson Way, Santa Clara, CA 95054, USA Abstract Billions of ...
Laser Scribing Laser Scribing Laser Scribing Eases the Further Mechanical Processing Laser scribing ist used for forming kerfs, e. g. for rated break points for separating semiconductors and ceramics. Depending on the material, scribing speeds of max. several meters per
ALASER 公司簡介 升暘股份有限公司之成立本著提供國內系統整合商最佳雷射解決方案並搭配光學設計使其能將此套用到系統設計上以提供終端客戶一完整加工機台進而提昇國內系統整合商之國際競爭力。
Ultrafast laser 'scribing' technique to cut cost, hike efficiency of solar cells ABSTRACT High Precision Scribing of Thin Film Solar Cells by a Picosecond Laser P.I.: Yung C. Shin, Gary Cheng (co-PI), Wenqian Hu, Martin Yi Zhang, Seunghyun Lee Purdue University In this paper, the feasibility of thin-film solar cells scribing via a ...
HB LED & LED Packaging - I-Micronews - Home Page MAIN CHALLENGES OBJECTIVES OF THE REPORT LED market analysis report with detailed descriptions of process, equipment and materials for LED assembly. The market is a high-growth field in the semiconductor industry. The supply chain is filled with
Laser Tools, Applications, Systems, Products, and Solutions | Coherent Coherent is the world†s leading supplier of laser solutions. Their portfolio of laser tools and products are used in scientific and commercial applications ... Coherent Lasers As one of the world's leading supplier of lasers and laser solutions, Coheren
Laser AP E.ppt [互換モード] - DISCO Corporation Processing Sapphires with Lasers Ablation Process Stealth Dicing For the processing of sapphire, which is used as the substrate material for high brightness LED, breaking with a diamond scriber used to be main stream. In accordance with the expansion of t
Microprocessing Systems - IPG Photonics High Power Fiber Lasers Laser Scribing of Thin Film Photovoltaic Panels Laser Lift-off (LLO) for the Manufacture of High Brightness LEDs Laser Micromachining of Ceramics, Alumina, Greensheet Ceramic Thin Film Patterning Laser Hole Drilling in Kapton Polyimide for Ink Jet Nozzles
